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Please note packaging may vary
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Features
- Excellent workability
- Ideal modulus for wide range of package sizes
- Meets thin wafer requirements
- High reliability
| Adhesive Film Thickness | 25.0 µm |
| Application Method | Lamination |
| Applications | Die Attach |
| Carrier Type | Polyolefin |
| Colour | White |
| Cure Type | Heat Cure, UV Cure |
| Dicing Tape Diameter | 12.0 |
| Extractable Ionic Content, Chloride (CI-) | 19.0 ppm |
| Extractable Ionic Content, Potassium (K+) | 1.0 ppm |
| Extractable Ionic Content, Sodium (Na+) | 2.0 ppm |
| Hot Die Shear Strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate | 3.1 kg-f |
| Key Characteristics | Work Life: Long Work Life |
| Moisture Absorption | 0.78 % |
| Physical Form | Film |
| Substrates | Laminate |
| Technology | Epoxy |
| Tensile Modulus, @ 250.0 °C | 185.0 N/mm² (26831.0 psi ) |
| Wafer Diameter | 12.0 |
| Weight Loss, TGA @ 200.0 °C | 0.27 % |
LOCTITE-ABLESTIK-ATB-F125E-TDS.pdf
Size: 67.48 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | F125E, 8" x 25µm, UV, F125E_25, 8" x 25µm, UV, F175E_25, 8" x 75µm, UV, F175E_25, 12" x 75µm, UV |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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