It is suitable for bonding integrated circuits and components onto laminate substrates.
- Low warpage
- Consistent bondline control with minimal die tilt
- Pre-cut wafer lamination equipment compatible
- Recommended for thin wafer handling applications
LOCTITE ABLESTIK CDF 625P8C8 25 per rl
Part number: 1870256£3,321.62 ex.VAT (£3,985.94 inc.VAT)
LOCTITE ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications.
Available to order. Your estimated delivery is: 19/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology: Hybrid chemistry
- Appearance: Silver film
- Cure: Heat cure
- Film Thickness: 25µm
- Application: Die attach
- Typical Package Application: PBGA, FBGA, CSP
LOCTITE-ABLESTIK-CDF-600-TDS.pdf
Size: 65.04 kB
Type: pdf
| Weight | 0.15 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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