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It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes.
Product Benefits
- Thermally conductive
- One component
- Low temperature cure
- Long pot life at room temperature
- High performance thermal management adhesive
- Excellent dispensing characteristics
- Fine filler
- Thin bondline
- Low thermal resistance
- Technology Epoxy
- Appearance Off-white
- Cure Heat cure
- Application Component assembly, Non-conductive adhesive
- Filler Weight, % 15 to 20
- Operating Temperature -40 to 125 °C
- Typical Package Application LED displays and Heat sensitive devices
LOCTITE-ABLESTIK-E-3503-1-TDS.pdf
Size: 67.39 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 10cc sy, 30cc sy |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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