It has been formulated to a high viscosity and thixotropy to enable higher aspect ratios of dispensed adhesive, thus allowing for easier adjustments for the final assembly. This material is engineered to meet the high reliability performance requirements for the optoelectronic / semiconductor industry.
Product Benefits
- Non-conductive
- One component
- Dual cure system
- High dispense aspect ratio
- Fast UV cure
- Fast cure at low temperatures
- High elongation strength
- High fracture toughness
- Good adhesion to LCP, PC, Ceramic and PCB
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