LOCTITE ABLESTIK NCF 218
This material is suitable for die to die, die to wafer (TSV) or die to substrate applications.
Product Benefits
- Enable fine pitch, narrow gap Cu Pillar
LOCTITE ABLESTIK NCF 218_20M, 12″, erk 4495
Part number: 2415951£193.89 ex.VAT (£232.67 inc.VAT)
LOCTITE ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications.
Available to order. Your estimated delivery is: 02/02/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Product Type: Fill Encapsulants, Film Adhesives, Compounds for Electronics, Industrial Adhesives
- Technology: BMI
- Appearance: Transparent yellow film
- Cure: Heat cure
- Application: Semiconductor, Films
- Typical Applications: Thermal Compression Bonding
LOCTITE-ABLESTIK-NCF-218-TDS.pdf
Size: 67.77 kB
Type: pdf
| Weight | 0.000166 kg |
|---|
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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