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LOCTITE ABLESTIK QMI2569
From £2,402.05
LOCTITE ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages.
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800″ x 0.800″. Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.
- Void-free bondline
- Maximum thermal dissipation
| Colour | Grey: Silver |
| Thixotropic Index | 8.0 |
| Viscosity | 35800.0 mPa·s (cP) |
LOCTITE-ABLESTIK-QMI2569-TDS.pdf
Size: 71.78 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 2oz, 2 oz |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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