The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800″ x 0.800″. Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.
- Void-free bondline
- Maximum thermal dissipation