It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C.
LOCTITE ABLESTIK QMI3555R 2oz jar
Part number: 1419015£2,573.68 ex.VAT (£3,088.42 inc.VAT)
LOCTITE ABLESTIK QMI3555R is a silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages.
Available to order. Your estimated delivery is: 05/12/2023

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Same day dispatch if you place your order before 3.30pm

Manufacturer CofC available at checkout
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