£285.79 ex.VAT (£342.95 inc.VAT)
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
Available to order. Your estimated delivery is: 10/01/2024
LOCTITE ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
| Applications | Die Attach |
| Coefficient of Thermal Expansion (CTE) | 40.0 ppm/°C |
| Cure Type | Heat Cure |
| Extractable Ionic Content, Chloride (CI-) | 20.0 ppm |
| Extractable Ionic Content, Fluoride (F-) | 20.0 ppm |
| Extractable Ionic Content, Potassium (K+) | 20.0 ppm |
| Extractable Ionic Content, Sodium (Na+) | 20.0 ppm |
| RT Die Shear Strength | 59.0 kg-f |
| Young's Modulus, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
Size: 77.42 kB
Type: pdf
| Weight | 0.019 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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