LOCTITE ABLESTIK QMI529HT-2A1
LOCTITE ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
- Electrically conductive
- Void-free bondline
- Thermally conductive
- Hydrophobic
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