LOCTITE ABLESTIK QMI536-1A1.5 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. LOCTITE ABLESTIK QMI536-1A1.5 is the 1.5 mil spacer version of LOCTITE ABLESTIK QMI536 adhesive.
- Stable at high temperatures
- Void-free bondline
- Excellent dielectric properties
- Excellent interfacial adhesion strength