Product Benefits
- Electrically non-conductive
- Hydrophobic
- Stable at high temperatures
- Void-free bondline
- Excellent interfacial adhesion strength
- Good resistance to “popcorning” after exposure to reflow temperatures
- Excellent dielectric properties
LOCTITE ABLESTIK QMI536HT 10cc sy
Part number: 540212£380.63 ex.VAT (£456.76 inc.VAT)
LOCTITE ABLESTIK QMI536HT die attach paste was designed to attach integrated circuits and components to advanced substrates.
Available to order. Your estimated delivery is: 13/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology: BMI/Acrylate
- Appearance: Pink
- Filler Type: Boron Nitride
- Cure: Skip-Cure Process or Heat Cure
- Application: Die attach
- Typical Package Application: PBGA, Array packages, Tape packs and CSP
- Typical Applications: Heat sinks, Heat slugs and Flip Chip
- Surface Finishes: Solder Mask, BT, FR, Au, Silicon, Polyimide, Kapton, Palladium, Alloy 42 and Mylar
LOCTITE-ABLESTIK-QMI536HT-TDS.pdf
Size: 78.64 kB
Type: pdf
| Weight | 0.0125 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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