LOCTITE ABLESTIK QMI536NB, Bismaleimide Resin, Die Attach, Low Bleed Non-conductive, PTFE-filled Paste.
The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated. These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.
- Stacked die application
- High resistance
- Low bleed
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