Product Benefits
- Non-conductive
- Hydrophobic
- Stable at high temperatures
- Void-free bondline
- Excellent interfacial adhesion strength
- Excellent dielectric properties
- High cohesive strength
LOCTITE ABLESTIK QMI550 5cc/10cc sy
Part number: 1767157£275.01 ex.VAT (£330.01 inc.VAT)
LOCTITE ABLESTIK QMI550 die attach paste was designed to attach integrated circuits and components to advanced substrates.
Available to order. Your estimated delivery is: 19/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology: BMI Hybrid
- Appearance: Off-white to beige liquid
- Filler Type: Fluoropolymer
- Cure: Skip-Cure Process
- Application: Die attach
- Substrates: PBGA's, CSP's, Array packages and Die Stack
- Surface Finishes: Solder Mask, BT, FR, Polyimide, Au and Other organic surfaces
LOCTITE-ABLESTIK-QMI550-TDS.pdf
Size: 76.92 kB
Type: pdf
| Weight | 0.007 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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