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LOCTITE ABLESTIK QMI9507-2C2
From £642.79
LOCTITE ABLESTIK QMI9507-2C2 is developed as a soft solder alternate for applications requiring high thermal or high electrical conductivity.
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
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Please note packaging may vary
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It contains spacers for improved bondline control. The optimized loading percentage is such that other bulk properties of the material remain unaffected.
- High thermal conductivity
- Excellent electrical conductivity
- Hydrophobic
- Stable at high temperatures
- Void-free bondline
- Controlled bondline thickness
- High adhesive strength
- High resistance to delamination
- Good resistance to “popcorning” after exposure to lead-free solder reflow temperature
- Technology Proprietary Hybrid Chemistry
- Cure Heat cure or Snap Cure
- Spacer Size 50 µm
- Application Die attach
- Filler Type Silver
- Typical Assembly Applications Attachment of integrated circuits and components to metallic leadframes
- Substrates Wide variety of metals, Ceramic surfaces, Copper, Ni/Pd/Au, Alloy 42 leadframes and Silver-plated copper leadframes
LOCTITE-ABLESTIK-QMI9507-2C2-TDS.pdf
Size: 69.82 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 10cc, 10cc sy, 25cc/30cc sy |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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