The formulation of this single-component material ensures a long pot and a very stable viscosity during use. LOCTITE ECCOBOND 50400-1 MOD adhesive is designed for use in automated assembly and in-line curing operations.
LOCTITE ECCOBOND 50400-1 MOD 10cc sy
Part number: 1189611£82.76 ex.VAT (£99.31 inc.VAT)
LOCTITE ECCOBOND 50400-1 MOD glob top is designed for encapsulating wire-bonded bare die on flexible Fr-4 and other substrates used primarily for smart card module assembly.
Available to order. Your estimated delivery is: 10/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology Epoxy
- Appearance Black
- Filler content by weight, % 38
- Percent Solids by Weight 100
- Cure Heat Cure
- Application Encapsulant - glob top
LOCTITE-ECCOBOND-50400-1-MOD-TDS.pdf
Size: 68.13 kB
Type: pdf
| Weight | 0.01 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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