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LOCTITE ECCOBOND 50500 D 20oz cq

Name: LOCTITE ECCOBOND 50500 D 20oz cq
SKU: CEL006763
Price: 1036.31 GBP
Availability: BackOrder

Part number: 1501785

£1,036.31 ex.VAT (£1,243.57 inc.VAT)

LOCTITE ECCOBOND 50500 D is designed to be used as a dam encapsulant in combination with a “fill” encapsulant in glob top applications for protecting wire bonded bare IC’s.

Available to order. Your estimated delivery is: 03/01/2024

Quantity	Discount (%)	Price
5 - 9	—	£1,036.31
10+	43.75 %	£582.93

Free shipping on orders over £75

Same day dispatch if you place your order before 3.30pm

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Please note packaging may vary

This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.

Product Benefits

Low modulus of elasticity
Low stress
High purity
Non-sag
Low warpage

Technology Epoxy
Appearance Black
Components One-component
Filler Weight, % 73 to 77
Percent Solids by Weight 100
Cure Heat Cure
Application Encapsulant
Operating Temperature -65 to 150 °C
Typical Assembly Applications Glob top applications, Protecting wire bonded bare IC's and BGA

LOCTITE-ECCOBOND-50500-D-TDS.pdf
Size: 66.79 kB
Type: pdf

Weight	1 kg
package size	20oz cq

Delivery info

Shipment method	Shipment cost
Click and Collect	FREE
Next day (orders above £75.00 ex.vat)	FREE
Next day (orders below £75.00 ex.vat)	£6.99
Next day pre 12AM	£17.99
Next day pre 10AM	£20.99
Saturday AM	£45.00