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LOCTITE ECCOBOND FP4460 encapsulant is designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on the device and package type.
- Low stress
- High purity
- Improved work life
- High-temperature performance
| Coefficient of Thermal Expansion (CTE), Below Tg | 20.0 ppm/°C |
| Colour | Black |
| Cure Schedule, @ 150.0 °C | 3.0 hr. |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 173.0 °C |
| Operating Temperature | -65.0 - 150.0 °C |
| Specific Gravity, @ 25.0 °C | 1.78 |
| Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa·s (cP) |
LOCTITE-ECCOBOND-FP4460-Encapsulant-SDS.pdf
Size: 448.02 kB
Type: pdf
LOCTITE-ECCOBOND-FP4460-TDS.pdf
Size: 66.05 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 10ml, 30cc, 30 cc, 55cc |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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