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LOCTITE ECCOBOND FP4546
From £175.98
LOCTITE ECCOBOND FP4546 liquid epoxy encapsulant is especially suited for use on flip-chip devices requiring improved crack/fracture resistance.
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may varyWhen fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
Product Benefits
- High purity
- Low coefficient of thermal expansion
- Improved toughness
- Technology: Epoxy
- Appearance: Black liquid
- Cure: Heat cure
- Application: Encapsulation, Semiconductor Underfill
- Typical Package Application(s): Flip chip devices
LOCTITE-ECCOBOND-FP4546-TDS.pdf
Size: 67.25 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 10cc, 30cc |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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