£156.04 ex.VAT (£187.25 inc.VAT)
LOCTITE ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly.
Available to order. Your estimated delivery is: 05/01/2024
LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
| Coefficient of Thermal Expansion (CTE), Above Tg | 80.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 28.0 ppm/°C |
| Extractable Ionic Content, Chloride (CI-) | 10.0 ppm |
| Extractable Ionic Content, Potassium (K+) | 10.0 ppm |
| Extractable Ionic Content, Sodium (Na+) | 10.0 ppm |
| Glass Transition Temperature (Tg) | 145.0 °C |
| Storage Modulus, DMA @ 25.0 °C | 7.3 GPa (7300.0 N/mm² , 1058775.0 psi ) |
| Storage Temperature | -40.0 °C |
| Viscosity, @ 25.0 °C Spindle 51, speed 5 rpm | 12500.0 mPa·s (cP) |
Size: 64.29 kB
Type: pdf
| Weight | 0.007 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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