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LOCTITE ECCOBOND UF 1173

Name: LOCTITE ECCOBOND UF 1173
SKU: LOCTITE-ECCOBOND-UF-1173
Availability: BackOrder

From £196.53

LOCTITE ECCOBOND UF 1173 is a single-component product designed to provide a uniform and void-free encapsulant underfill.

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LOCTITE ECCOBOND UF 1173 is an epoxy-based, single-component underfill which maximizes the device’s temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.

Single component
Void free underfill
Long pot life
Low CTE

Colour	Black
Cure Type	Heat Cure
Technology	Epoxy

LOCTITE-ECCOBOND-UF-1173-TDS.pdf
Size: 67.67 kB
Type: pdf

Weight	N/A
Packaging	10cc sy, 55cc sy

Delivery info

Shipment method	Shipment cost
Click and Collect	FREE
Next day (orders above £75.00 ex.vat)	FREE
Next day (orders below £75.00 ex.vat)	£6.99
Next day pre 12AM	£17.99
Next day pre 10AM	£20.99
Saturday AM	£45.00