LOCTITE ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
| Coefficient of Thermal Expansion (CTE), Above Tg | 171.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 55.0 ppm/°C |
| Cure Schedule, @ 130.0 °C | 8.0 min. |
| Glass Transition Temperature (Tg) | 102.0 °C |
| Viscosity, Cone & Plate, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa·s (cP) |
| Work Life | 3.0 day |
Size: 68.77 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 30ml, 55ml |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
Free Delivery Over £75
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