LOCTITE EDAG 5915 E&C epoxy adhesive is designed for bonding surface mount devices to flexible or rigid printed circuits.
- One component
- Conductive
- Fast cure
LOCTITE EDAG 5915 E&C epoxy adhesive is designed for bonding surface mount devices to flexible or rigid printed circuits.
Cure Schedule, @ 130.0 °C | 15.0 min. |
Cure Type | Heat Cure |
Number of Components | 1 Part |
Operating Temperature | 160.0 °C |
Shear Strength, Aluminum | 1000.0 psi |
Storage Temperature | -20.0 °C |
Technology | Epoxy |
Viscosity, Brookfield, @ 25.0 °C Spindle 7, Speed 20 rpm | 120000.0 mPa·s (cP) |
Volume Resistivity | < 0.0005 Ohm cm |
Size: 64.81 kB
Type: pdf
Weight | 0.1 kg |
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package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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