It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents.
- One component
- Solvent-free
- Low temperature cure
- 100% Solids
It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents.
Applications | Encapsulating |
Colour | Off White |
Cure Schedule, @ 120.0 °C | 1.0 hr. |
Cure Type | Heat Cure |
Number of Components | 1 Part |
Shelf Life | 180.0 day |
Shore Hardness, Shore D | 90.0 |
Storage Temperature | 0.0 - 8.0 °C |
Technology | Epoxy |
Thermal Conductivity | 1.36 W/mK |
Viscosity, @ 25.0 °C | 85000.0 mPa·s (cP) |
Size: 64.13 kB
Type: pdf
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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