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It is a high-flow material which requires a cavity of flow control barrier to prevent excessive flow. Please refer to the TDS for alternate cure schedules.
- Two components – requires mixing
- High purity
- Non-conductive
- High flow
- Product Type: Potting Compounds, Encapsulants, Compounds for Electronics
- Technology: Epoxy
- Appearance,Resin (Component A): Black
- Appearance, Hardener B(Component B): Gray Tan
- Components: Two components - requires mixing
- Mixing Ratio, by weight Component A: Component B: 100 : 100
- Cure: Heat cure
- Application: Encapsulation
- Typical Applications: Encapsulation of bare chips mounted to plastic substrates and Potting of small hybrid circuit modules
LOCTITE-STYCAST-ES-4322-TDS.pdf
Size: 68.82 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 1gal, B, 1 gal pail |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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