This product is supplied as a dry compound coated onto an aluminum substrate. The compound is designed to flow at the phase change temperature, conforming to the surface features of the heat sink and component. Upon flow, air is expelled from the interface, reducing thermal impedance, performing as a highly efficient thermal transfer material. LOCTITE TCF 2000 AF is supplied as die-cut preforms to match a wide variety of electronic components. Custom parts are also available upon request with low cost tooling.
LOCTITE TCF 2000 AF
LOCTITE TCF 2000 AF phase-change thermal interface material is suitable for use between a heat sink and a variety of heat generating components.
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