It has been formulated to be non-corrosive and non-reactive with these systems.
- Distinctive blue color aids in visual purge endpoint detection
- Rheology ensures fast removal of all solder powder particulates and reactive flux from flow path
- Prevents inconsistent dispense volumes and clogging due to solder paste dry-out
- Allows easy equipment cleaning and maintenance to ensure long dispensing valve and tip life
- Compatible with Indium Corporation’s no-clean and solvent-clean dispensing and jetting solder paste and TACFlux products