Critical resin residues, which cause poor adhesion of conformal coatings and delamination effects can be localized during the production and removed by a cleaning step. Thus the critical resin amount of <40 μg/cm² (258.06 μg/sq in) according to J-STD 001 can be met.
This test complements analytical methods such as Ionic Contamination Measurement and the ZESTRON Flux Test (detection of activators/acids).
Advantages of the ZESTRON Resin Test:
- Localized detection of resin based residues on electronic assemblies
- Quick and easy test method. No extensive training required
- No specific test equipment needed
- No additional floor space requirements
- No investment costs
- Can be used throughout the facility
- On-site sampling inspection during production
- Low cost per tested part
Application:
- Detection of resin-based residues on pcb assemblies
- On-site sampling inspection during production
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