Indium Rework Fluxes

Exclusive UK Partner

Delivery

Next day delivery on in stock items ordered before 4.30pm

 

Product Description

  • NC-771 Pb-Free No Clean Flux

    NC-771 is a halogen-free, low-residue, all-purpose liquid flux that passes the SIR test in the un-reflowed state. It can be used in a standard SnPb or Pb-free rework or soldering process. In addition to the aesthetic benefits, the ultra-low post-reflow residue is non-tacky and will not interfere with probe testing.

Product Specification

  • Passes SIR test in the un-reflowed state
  • Halogen-free
  • Backwards compatible with eutectic SnPb
  • Ideal for high-reliability electronic circuitry
  • Benign, non-sticky, post-reflow residue
  • Provides excellent wetting
  • Wide reflow process window

Product Description

  • Flux Pens

    Indium Corporation now offers a full line of flux pens in standard industry packaging. The technologically advanced pen has exceptional leak control and dispensing capability. Each pen contains 10ml of one of Indium Corporation’s state-of-the-art fluxes designed for printed circuit board or other electronic/electrical assemblies.

Product Specification

  • Compatible with both tin-lead and lead-free soldering processes
  • Have a shelf life of 2 years from the date of manufacture when unopened and stored at 72°F
  • Ship as “non-hazardous” by land due to the small quantity exemption

Product Description

  • TACFlux

    Indium Corporation manufactures a complete line of TACFlux®, which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chip), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical, as TACFlux® may sit for hours with no reflow degradation.

    • Packaging Options
      • 10gm, 100gm, 100gm Jar:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

TACFlux® Typical
Tackiness
(grams)
Typical
Viscosity
(kcps)
Max
Temp
(°C)
Reflow
Residue
(%)
Reliability
J-STD 004
Flux
Classification
Cleaning Method
No-Clean:
007 190 570 310 47 Pass R0L1 No-Clean/Semi-aqueous Solution
012 140 220 250 45 Pass R0L0 No-Clean/Semi-aqueous Solution
014 141 351 250 45 Pass R0L0 No-Clean/Semi-aqueous Solution
018 160 255 250 36 Pass R0L0 No-Clean/Semi-aqueous Solution
020 175 470 250 45 Pass R0L0 No-Clean/Semi-aqueous Solution
021 225 365 230 56 Pass R0L0 No-Clean/Semi-aqueous Solution
023 225 410 300 42 Pass R0L1 No-Clean/Semi-aqueous Solution
Water-Wash:
019 175 500 325 45 Pass 0RM0 Water
025-NP 800 10* 370 47 Pass 0RM0 Water

Product Description

  • WF-7742

    WF-7742 is a VOC-free, no-clean flux specifically developed for Pb-free wave soldering of surface mount, mixed-technology, and through-hole electronic assemblies. WF-7742 is a water-based, nonflammable formulation dramatically reducing VOC emissions and eliminating special storage requirements. A wide process window provides excellent solderability on difficult-to-solder assemblies and reduces solder balling.

Product Specification

  • Excellent surface wetting
  • Eliminates cleaning
  • Wide process window
  • Use with Pb-free and SnPb assembly processes

Product Description

  • WF-7745

    WF-7745 is a water-based, VOC-free, halogen-free, no-clean wave solder flux designed for wave soldering through-hole, bottom-side surface mount and mixed-technology circuit boards. It performs well with both Pb-free and SnPb solders and processes. WF-7745 is non-flammable, dramatically reducing volatile organic compound emissions and eliminating special flammable storage conditions. WF-7745 easily passes the IPC TM-650 copper mirror test. It also passes the IPC TM-650 copper corrosion test, showing no evidence of green. This high degree of corrosion resistance is virtually unheard of with water-based no-clean fluxes. Even with this high degree of corrosion resistance, WF-7745 solders as well as many halogen-containing, low solids, no-clean fluxes, yielding superior hole-fill and reduced solder balling.

Product Specification

  • ORL0 per J-STD-004A
  • Compatible with all common Pb-free and SnPb wave soldering alloys
  • Superior hole fill
  • No post-soldering green corrosion
  • Low degree of solder balling
  • Non-flammable and non-corrosive
  • Can be shipped as non-hazardous

Product Description

  • WF-9942

    WF-9942 is a highly active no-clean wave solder flux designed for use with through-hole and mixedtechnology assemblies. It has been effectively used in both tin-lead and lead-free soldering operations. WF-9942 is a second generation no-clean flux designed to meet the requirements of J-STD-004. Although not specifically designed for lead-free soldering (third generation no-clean) or to the requirements of the later J-STD-004B (fourth generation no-clean), WF-9942 has been successfully and reliably used to assemble millions of circuit boards for the last 15 years. WF-9942 exhibits very good SIR and ECM results when tested to the J-STD-004 and Telcordia GR-78 requirements. A rosinfree fourth generation product comparable to the WF-9942 is Indium Corporation’s WF-9958.

Product Specification

  • Passes J-STD-004 SIR and ECM requirements for ORL0 and passes Telcordia GR-78 SIR requirements
  • Very low solder balling
  • Wide process window for soldering larger and/or thick circuit boards
  • Can be applied by foam or spray fluxing
  • Tested for use with all common lead-free and tin-lead alloys, including SAC305, SAC105, SAC0307, silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995, 96.5Sn/3.5Ag, 63Sn/37Pb, 60Sn/40Pb, and many others
  • Tested compatibility with Hot Air Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper Surfaces
  • Rosin-free for enhanced pin probe testability