Indium Semi-Conductors

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Delivery

Next day delivery on in stock items ordered before 4.30pm

 

Product Description

  • Indium 8.9LDA

    Indium8.9-LDA is specially designed for IGBT manufacturing. The formulation has been optimized for vacuum reflow soldering of large area die. Ultra-low total voids are possible (typically <0.5%) using a variety of reflow profiles: two examples of suitable vacuum reflow profiles are shown on page 2. The paste is formulated to be cleaned easily using common aqueous-based cleaning solutions. Good cleanability ensures consistently high wire bonding pull-strength. Indium8.9-LDA is suitable for application by either screen or stencil printing, and offers unprecedented print transfer efficiency with a long open life, making it suitable for use in a broad range of processes.

    • Packaging Options
      • 100gm Syringe, 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Ultra-low voiding, even on large die
  • Easily cleaned for high wire bond strength
  • High print transfer efficiency using screen or stencil
  • Versatile profiling characteristics for optimum results
  • Improved process yields and material utilization

Product Description

  • PoP Paste Indium9.88-HF

    PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.

Product Specification

  • Halogen-free – no intentionally added halogens
  • Eliminates defects due to package-warping
  • Air reflow
  • Rheology optimized for both dipping and packageretention
  • Designed for use with both SAC305 and Sn63/Pb37 alloys
  • Excellent solderability
  • Long pot life
  • Suitable for use down to 0.4mm pitch

Product Description

  • PoP Flux8.9HF-LV

    PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system.

Product Specification

  • Application by dipping or dispensing
  • Halogen-free (no intentionally-added halides)
  • Optimized for Pb-free (SAC alloy) applications
  • Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes
  • Air reflow
  • Bubble-free packaging