Indium Solder Paste

Exclusive UK Partner

Delivery

Next day delivery on in stock items ordered before 4.30pm

 

Product Description

  • Indium 8.9HF Pb-Free Solder Paste

    Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Halogen-free per EN14582 test method
  • Low BGA, CSP, QFN voiding
  • One of our most stable pastes
  • High transfer efficiency through small apertures (≤0.66AR)
  • Eliminates hot and cold slump
  • High oxidation resistance
  • Wets well to oxidized BGA and pad surfaces
  • Excellent soldering performance under high-temperature and long reflow processes
  • Clear, probe testable flux residue
  • Compatible with SnPb alloys

Product Description

  • Indium 8.9HFA Pb-Free Solder Paste

    Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Eliminates clogged apertures through advanced rheology
  • High speed printing (>100mm/second capable)
  • Eliminates hot and cold slump
  • Excellent wetting
  • High oxidation resistance
  • Halogen-free per EN14582 test method

Product Description

  • Indium 8.9HF-1 Pb-Free Solder Paste

    Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1 minimizes false failures in ICT.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • High oxidation barrier to eliminate graping and HIP defects
  • Highly probe-testable flux residue
  • Halogen-free per EN14582 test method
  • Excellent print transfer efficiency on 0.4mm pitch CSPs

Product Description

  • Indium 3.2HF Water-Soluble Solder Paste

    Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

    • Packaging Options
      • 500gm Jar, 500gm Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Exceptional printing
  • Long stencil life
  • Good response-to-pause
  • Wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability
  • Low-voiding
  • Halogen-free

Product Description

  • Indium 6.4R

    Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause. Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, D-Paks, LGAs, etc.)

    • Packaging Options
      • 100gm Syringe, 500gm Jar, 500gm Cart, 600gm Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Lowest voiding water-soluble flux for solder paste:
    – Reduced largest voids
    – Fewer voids
    – Minimized voiding overall
    – For BGA, CSP, and bottom termination components, such as QFNs
  • Exceptional printing process window:
    – Excellent response-to-pause
    – Long stencil life (>8 hours in controlled environment)
    – Prints consistently at a wide range of speeds
  • Wide reflow process window for profiling
  • Excellent wetting on a variety of surface finishes
  • Maintains tack over time
  • Suitable for SnPb eutectic alloys as well as Pb-free alloys

Product Description

  • Indium 5.7LT Solder Paste

    Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low-temperature, Pb-free solution.

    • Packaging Options
      • 10gm/100gm Syringe, 500gm Jar, 600gm Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Formulated for use with the eutectic 58Bi/42Sn, 57Bi/42Sn/1Ag, and 57.6Bi/42Sn/0.4Ag alloys
  • Low-temperature Pb-free solution
  • Clear residue
  • Exceptional wetting in air reflow
  • Halogen-fre

Product Description

  • Indium NC-SMQ92J Solder Paste

    NC-SMQ®92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multipoint probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Excellent wetting reflow in air
  • Probe-testable residue
  • Extended open time
  • Consistent fine-pitch printing
  • Strong initial tack strength and long-term stability
  • High humidity resistance
  • Halogen-free

Product Description

  • Solder Research Kit

    At Indium Corporation, we have created a strong research and development team that has made us one of the top solder manufacturers in the world, so we understand the challenges of developing viable products for today’s marketplace. One of the key hurdles in product development is being able to test a variety of options at a reasonable cost. With our Solder Research Kit, you can select various assembly solders to experiment with, then choose the one that works best in your application. Solder selection depends on many factors, including:

    • Maximum soldering temperature
    • Maximum and minimum operating temperature
    • Lead content/Pb-free composition
    • Base metal compatibility
    • Tensile strength
    • Corrosion resistance
    • Electrical/thermal conductivity
    • Thermal coefficient of expansion
    • Physical appearance
    • Available solder forms

Product Specification

Base Metal Recommended
Indalloy® Flux
Recommended Solder
Indalloy® # (Alloy)
Incompatible
Solders
Gold (Au) (See note 1)
#5R
Silver (Ag) (See note 2)
Palladium (Pd)
Platinum (Pt)
#5R, #5RMA,
#5RMA-RC
#4 (100%In)
#2 (80.0In/15.0Pb/5.0Ag)
#164 (92.5Pb/5.0In/2.5Ag)
#182 (80.0Au/20.0Sn)
InPb alloys
#290 (97.0In/3.0Ag)
Sn
SnPb
InSn
SnPbIn
SnPbBi
(See note 5)
Clean
Copper (Cu)
#5R, #5RMA,
#5RMA-RC
#42 (46.0Bi/34.0Sn/20.0Pb)
Sn62 (62.5Sn/36.1Pb/1.4Ag)
Sn63 (63.0Sn/37.0Pb)
#121 (96.5Sn/3.5Ag)
#133 (95.0Sn/5.0Sb)
#151 (92.5Pb/5.0Sn/2.5Ag)
#282 (57.0Bi/42.0Sn/1.0Ag)
SnAgCu alloys
In
InPb
InSn
InPbAg
(See note 4)
Tin (Sn)
Solder Plate (SnPb)
#5R, #5RMA,
#5RMA-RC
#1E (52.0In/48.0Sn)
#106 (63.0Sn/37.0Pb)
#121 (96.5Sn/3.5Ag)
#282 (57.0Bi/42.0Sn/1.0Ag)
SnAgCu alloys
(See note 3)
Oxidized Cu
Cu Alloys (Brass, Bronze)
#4, #5RA, #5RA-RC 63.0Sn/37.0Pb
62.0Sn/36.0Pb/2.0Ag
SnAgCu alloys
In-containing alloys
(See note 4)
Nickel (Ni)
Lead (Pb)
#4, #5RA, #5RA-RC #106 (63.0Sn/37.0Pb)
#1E (52.0In/48.0Sn)
InPb alloys
SnAgCu alloys
(See note 5)
Aluminum (Al) #3 #201 (91.0Sn/9.0Zn) SnPb has poor
corrosion resistance
Stainless Steel #2 #1E (52.0In/48.0Sn)
#106 (63.0Sn/37.0Pb)
#121 (96.5Sn/3.5Ag)
Avoid Pb and Cd for
food applications
Steel #1 #106 (63.0Sn/37.0Pb)
#121 (96.5Sn/3.5Ag)
Compatible with
most solders

Product Description

  • Indium 8.9 Pb-Free Solder Paste

    Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • High transfer efficiency through small apertures (≤ 0.66AR)
  • Excellent wetting to all common finishes at high and low peak reflow temperatures
  • Clear, probe testable flux residue
  • Eliminates head-in-pillow defects

Product Description

  • Indium NC-SMQ92H Solder Paste

    NC-SMQ®92H is a halogen-free, air reflow, no-clean solder paste formulated for low flux spatter. It provides consistent fine-pitch paste deposition, and excellent stencil life and tack time. NC-SMQ®92H has a hard flux residue and can accommodate reflow temperatures higher than typically required for many Pb-containing alloys. NC-SMQ®92H meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.

    • Packaging Options
      • 500gm Jar, 500gm Cart, 1kg Cart:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Compatibility with common conformal coatings
  • Clear, benign residue
  • Superior stencil life
  • Exceptional wetting in air reflow
  • Outstanding print characteristics
  • Halogen-fre