Indium Corp Lead Free Solder Paste 8.9HFA SAC305 Type 4 88.5%

Indium Corporation Indium8.9HFA SAC305 Type 4 88.5% is a no-clean, lead-free solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu (SAC) alloys. Engineered for modern electronics manufacturing, it supports the transition from conventional Pb-bearing solders while delivering exceptional print consistency and reliability.

Designed for high-volume production environments, Indium8.9HFA offers excellent stencil print transfer efficiency across a broad range of process conditions. Its advanced rheology helps eliminate clogged apertures and ensures consistent paste deposition, even in fine-pitch and high-density assemblies.

Key Features:

• Excellent stencil print transfer efficiency
• Eliminates clogged apertures through advanced rheology control
• High-speed printing capability (>100mm/second)
• Eliminates hot and cold slump
• Excellent wetting performance
• High oxidation resistance
• Halogen-free per EN14582 test method

This SAC305 Type 4 solder paste with 88.5% metal content is suitable for high-reliability electronic assembly applications where consistent performance and process stability are critical.