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SolderStar Pro Vapour Phase

The SolderStar PRO - VP system allows users of batch and in-line vapour phase soldering machines to fully profile their products in the same way as a conventional reflow oven.

The system includes the SolderStar PRO data-logger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapour reflow and vacuum stages of the machine.

Data can be passed to a nearby PC via wireless telemetry allowing the profile to be viewed in real-time by the user.

Once data capture is complete the heat shield can be opened and the datalogger removed,allowing rapid cool down cycles and minimising the risk of overheating the profiling unit.
Manufacturer: Solderstar

Featuring SolderStar connection System

Miniature Profling Datalogger

Low mass vacuum capable shield

PC Analysis Software with

Vapour Phase process support

2.4Ghz Telemetry available providing datalink within vacuum stage machine

System Advantages

Standard data logger and heat shield solution maximised datalogger protection

Low mass thermal shield provides minimal impact to process

Extendable for control of wave / selective or reflow soldering

Unique SmartLink connection system provides quick datalogger connection to a range of products and accessories

Error free Wireless Telemetry with automatic offload and catchup ensure no gaps in data transmission

Extendable Wireless range > 100 Metres from machine


Technical Data

Standard Equipment

Size/Weight 125mm x 52mm x 9mm,110g
Channels upto 16 Channel Versions Available
Memory 120,000 Memory Points Sampling 0.1s - 10 Minutes Measurement Range -150 - 600 °C
Accuracy ±1 °C Resolution ±0.02 °C
Max. Internal Temperature +85 °C (Auto Shutdown on over temp.) Power Rechargeable High Temperature Nimh
Communications USB (Type A - Mini B) or 2.4Ghz Wireless

• 6 Channel Vapour Phase Barrier

• 6 Type K thermocouples

• Equipment case

This product can be supplied as a stand-alone system complete with datalogger, or as an accessory to an existing SolderStar system. Please contact SolderStar or your local supplier for the optimum configuration for your soldering processes.



Type K, EN 05842:1993

Class 1 / ANSI MC 96.1

Optional Equipment

Supplied Model HS-VP006-01
Material Aluminium - PTFE Coated
Weight 6 Channel Version: 620g

• 8 Channel Barrier

• 2.4Ghz Wireless Telemetry

• USB powered Wireless range


Thermal Protection Duration





0 10 20 30 40 50

Survival Time - Minutes

Additional Process Support

Other heatshield sizes are available for special process requirements.

Wireless Telemetry Option

Frequency 2.4GHZ Transceiver
Channels 128 Individual Channels
Protocol Zigbee PRO - Duplex Transmission



A range of process specific accessories are available to extend the system for
use with Reflow Wave/Selective Soldering and Vapour Phase processes.
Language Support
Windows™ XP Vista/Windows 7/8 32 & 64 Bit
English, French, German, Italian, Portuguese, Spanish & Chinese



Conro Electronics Ltd
Unit 7, Orbital 25, Dwight Road, Watford, Hertfordshire
WD18 9DA

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We offer next day and Saturday deliveries excluding orders made after 3pm weekdays, weekends and public holidays.

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ISO 9001:2015

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