LOCTITE ABLESTIK 84-1LMIT

LOCTITE ABLESTIK 84-1LMIT is a silver-filled electrically conductive epoxy adhesive developed for medium die-attach applications in microelectronics and semiconductor assembly. This heat-curing adhesive delivers strong bonding performance while providing both electrical conductivity and effective thermal transfer for demanding electronic environments.

The epoxy formulation features a silver paste appearance and is designed for controlled application using syringe dispensing or screen printing processes. Its solvent-free composition and low outgassing characteristics make it suitable for precision assembly operations where material purity and stability are important.

LOCTITE ABLESTIK 84-1LMIT combines high electrical conductivity with excellent thermal conductivity to support reliable performance in electronic component bonding. The material is commonly used in component assembly applications requiring conductive bonding and stable heat-cured adhesive performance.

• Electrically conductive epoxy adhesive
• Silver-filled formulation
• High thermal conductivity
• Heat-curing epoxy system
• Low outgassing formulation
• Suitable for syringe dispensing or screen printing
• Designed for medium die-attach applications
• Solvent-free composition

LOCTITE ABLESTIK 84-1LMIT meets the requirements of MIL-STD-883 Method 5011, supporting use in electronic assembly environments where conductive adhesive bonding is required.