Indium Thermal Interface Material

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Next day delivery on in stock items ordered before 4.30pm

 

Product Description

  • Heat-Springs

    Indium Corporation’s patented Heat-Spring® preforms improve contact between two surfaces for more uniform thermal conductivity. Each Heat-Spring® pattern was designed for specific applications, which are described below.

    • Packaging Options
      • Custom Tray, Tape & Reel:
      Download Technical Data Sheet

    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

Heat-Springs® are available in a variety of alloys, and these are the most popular:

  • 99.99 Indium
  • InSn
  • InAg
  • Sn+

Product Description

  • HSMF

    HSMF thermal interface material is a metal/polymer hybrid technology designed to incorporate some of the benefits of both technologies. The polymer portion exhibits very high compliance and some amount of tackiness. This helps to achieve a low interfacial resistance. The metal portion is high thermal conductivity improving the overall performance of the system. This material resists pump-out and bake-out, performs better over time, and is easy to use. The standard HSMF materials are well suited for TIM2 applications while the OS version is specifically designed for use in burn-in and test applications.

    • Packaging Options
      • Custom Tray, Tape & Reel:
      Download Technical Data Sheet

    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Color Dark gray, aluminum backer
  • Hardness
  • Grease is compliant @ 10psi
  • Aluminum backer 310MPa
  • Thickness Range 100, 150 microns ± 12.5 microns
  • Pressure 10psi minimum to 500psi
  • Maximum Operating Range -40–175°C

Product Description

  • HSMF-OS

    Thermal interface material performance is crucial for burn-in applications. Ease of use and reliability are key factors as well. HSMF-OS is not designed for high-demand thermal applications as its thermal resistance is not that of a metallic TIM, such as an indium HSK product. However, it does have distinct attributes that address industry challenges, making it an excellent choice for many applications.

    • Packaging Options
      • Custom Tray, Tape & Reel:
      Download Technical Data Sheet

    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner

Product Specification

  • Adhesive Properties One of the challenges associated with a burn-in TIM material is attachment methods. In some cases, adhesives/tapes can be used or fixturing is applied to hold the TIM in place. This can be both cumbersome, costly or have an adverse impact on performance. HSMF-OS has inherent adhesive properties that allow for hand placement, removing the need for additional steps and fixtures. The table below illustrates the material’s ability to retain adhesion strength.
  • High-Insertion Capability HSMF-OS is designed for high-insertion capability. The aluminum layer is the interface with the component being tested. Given aluminum’s tensile strength of approximately 90MPa and a soft compliant polymer backing, this provides a configuration with ”designed in” insertion survivability. HSMF products come with a release liner to protect the polymer layer. Be sure to remove the release liner before placement.