BERGQUIST GAP FILLER TGF 1000SR

BERGQUIST GAP FILLER TGF 1000SR is a two component silicone based thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. When cured this product provides a soft, thermally conductive,form-in place elastomer that is ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. This product is intended for use in automotive electronics applications where a strong structural bond is not necessary