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BERGQUIST GAP FILLER TGF 1100SF
From £33.81
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
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Same day dispatch if you place your order before 3.30pm
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Please note packaging may vary
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BERGQUIST GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
- Thermal conductivity: 1.1 W/m-k
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-0 compliance
| Cure Schedule, Recommended @ 25.0 °C | 24.0 hr. |
| Density | 2.0 g/cm³ |
| Dielectric Constant, @ 1kHz | 5.0 |
| Flame Rating | V-0 |
| Heat Capacity, ASTM E1269 | 0.9 J/g-K |
| Mix Ratio, by Volume | 1 : 1 |
| Mix Ratio, by Weight | 1 : 1 |
| Pot Life, @ 25.0 °C | 4.0 hr. |
| Shelf Life | 6.0 mon. |
| Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00 | 60.0 |
| Storage Temperature | 25.0 °C |
| Thermal Conductivity | 1.1 W/mK |
| Volume Resistivity | 1×10 Ohm m |
| Resin | |
| Colour, Resin | Yellow |
| Hardener | |
| Colour, Hardener | Red |
BERGQUIST-GAP-FILLER-TGF-1100SF.pdf
Size: 71.38 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 50cc sy, 50 cc sy, 400cc sy, 400 cc sy, 1200cc liquid sy, 1200 cc liquid sy |
| type |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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