BERGQUIST GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
- Thermal conductivity: 1.1 W/m-k
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-0 compliance