BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength.
- Low volatility for silicone-sensitive applications
- Thermal conductivity: 1.8 W/mK
- Ultra-conforming, with excellent wet-out
- 100% solids — no cure by-products
Reviews
There are no reviews yet.