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BERGQUIST® GAP FILLER TGF 3010APS is a two component, silicone free dispensable liquid with an extremely high dispense rate of 80 cc/sec curable at room temperature. With unique combination of high dispense rate, good thermal conductivity and low compressive stress it is ideal for high throughput applications like automotive power storage systems in the automotive industry.
- Thermal conductivity: 3.0 W/m-K
- Non-silicone gap filler
- Fast dispense rate: > 80 cc/sec
- Compressable (shore OO 75)
- Room temperature cure
| Cure type | Heat Cure |
| Flame rating | V-0 |
| Operating temperature | -40.0 - 80.0 °C |
| Thermal conductivity | 3.0 W/mK |
| Mixed | |
| Color, Mixed | Black |
| Resin | |
| Color, Resin | Black |
| Hardener | |
| Color, Hardener | White |
BERGQUIST-GAP-FILLER-TGF-3010APS-TDS.pdf
Size: 70.11 kB
Type: pdf
| Weight | N/A |
|---|---|
| package size | |
| Packaging | TGF 3010APS-A-8, TGF 3010APS-B-8 |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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