BERGQUIST GAP FILLER TGF 3500LVO is ultra-conforming and features low volatility which makes it the ideal solution for use in medical electronics and other fragile or low stress assemblies such as Optics and Automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components and will cure at room temperature or can be sped up with the addition of heat.
- Thermal conductivity: 3.5 W/m-K
- 100% solids with no additional cure by-products
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out for low stress interface applications
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