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BERGQUIST GAP PAD TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The material offers exceptional thermal performance at low pressures. BERGQUIST GAP PAD TGP 12000 is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
- Thermal conductivity of 12 W/m-K.
- Highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface
- Low compression stress
- Product Type: Thermal gap pads,Thermal management materials
BERGQUIST-GAP-PAD-TGP-12000-TDS.pdf
Size: 64.09 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | L8.5IN x W8.5IN x H1MM, L8.5IN x W8.5IN x H1.5MM, L8.5IN x W8.5IN x H2MM, L8.5IN x W8.5IN x H2.5MM, L8.5IN x W8.5IN x H3MM, L8.5IN x W8.5IN x H3.5MM, L8.5 x INW8.5IN x H4MM |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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