BERGQUIST GAP PAD TGP 1350
From £1.00
BERGQUIST GAP PAD TGP 1350 is a silicone, highly conformable, thermally conductive and reworkable gap filler for fragile components.
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BERGQUIST GAP PAD TGP 1350 is a pre-cured silicone based thermally conductive gap pad. It is reinforced with a PEN film which not only allows rework but also improves resistance to puncture and tear. This product is highly conformanble and compliant making it ideal for the assembly of fragile components. It is also highly durable and UL 94 V-0 compliant.
- Thermal conductivity: 1.3 W/m-K
- Easily compressible (shore OO 30)
- High durability
- UL94 V-0 compliance
| Carrier type | PEN Film |
| Colour | Light Pink |
| Operating temperature | -60.0 - 150.0 °C |
| Technology | Silicone |
| Thermal conductivity | 1.3 W/mK |
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BERGQUIST-GAP-PAD-TGP-1350-TDS.pdf
Size: 68.20 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 16in x 8in x 0.08 sh, 16in x 8in x 0.06 sh, 16in x 8in x 0.04in sh, 16in x 8in x 0.020, 16in x 8in x 0.125 sh, 0.906in x 0.748in x 0.125 |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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