BERGQUIST GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces.This product has no silicone content and is therefore ideal for silicone sensitive applications.
- Thermal conductivity: 3 W/m-K
- Silicone free
- UL94 V-0 compliance
- Reworkable
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