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BERGQUIST GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
- Thermal conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
| Carrier type | Fiberglass |
| Colour | Blue |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.508 - 3.175 mm |
| Technology | Silicone |
| Thermal conductivity | 3.0 W/mK |
| Young's modulus, ASTM D575 | 110.0 KPa (16.0 psi ) |
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BERGQUIST-GAP-PAD-TGP-HC3000-TDS.pdf
Size: 69.68 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 8in x 16in x 0.1, 8in x 16in x 0.06, 16in x 8in x 0.04 sh, 16in x 8in x 0.125 sh, 16in x 8in x 0.02 sh, 16in x 8in x 0.08 sh, 16in x 8in x 0.01 sh, 1.79in x 0.79in, 0.63in x 1.81in x 0.06, 2.28in x 1.5in x 0.06, 16in x 8in x 0.1 sh, 1.18in x 1.18in x 0.02, 16in x 8in x 0.03 sh, 16in x 8in x 0.01 sh, 1.02in x 3.43in x 0.06, 1.58in x 3.43in x 0.06, 3.77in x 7.48in x 0.1, 1.22in x 0.433in x 0.080, 0.787in x 0.787in x 0.080, 0.315in x 0.315in x 0.080, 1.732in x 3.661in x 0.06in, 1.142in x 2.638in x 0.06, 1.496in x 2.283in x 0.06in, 49mm x 34mm x 0.508mm, 7.929" x 10.583" x 0.100", 0.394" x 1.142" x 0.080", 0.394" x 1.142" x 0.060" |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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