BERGQUIST GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
- Thermal conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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