BERGQUIST SIL PAD TSP 1750

The combination of high thermal conductivity and excellent dielectric strength retention after humidity exposure is formulated into the BERGQUIST SIL PAD TSP 1750 elastomeric pad. The material transfers heat due to its high loading of speciality ceramics and its ability to exclude air from large interfaces. BERGQUIST SIL PAD TSP 1750 relies on new processes that minimize the effect of high humidity on the electrical properties of the finished material. Therefore, exposure to humid environments during assembly, or over long-term operating conditions, will not severely affect the ability of the material to perform.