BERGQUIST SIL PAD TSP 1750
Part number: 2166509£1.20 ex.VAT (£1.44 inc.VAT)
BERGQUIST SIL PAD TSP 1750 is designed to be an economical material solution for high humidity, high dielectric requirements.
Available to order. Your estimated delivery is: 12/05/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
The combination of high thermal conductivity and excellent dielectric strength retention after humidity exposure is formulated into the BERGQUIST SIL PAD TSP 1750 elastomeric pad.
The material transfers heat due to its high loading of specialty ceramics and its ability to exclude air from large interfaces.
BERGQUIST SIL PAD TSP 1750 relies on new processes that minimize the effect of high humidity on the electrical properties of finished material. Therefore, exposure to humid environments during assembly, or over long term operating conditions, will not severely affect the ability of the material to perform.
- Technology Silicone
- Appearance Yellow
- Reinforcement Carrier Fiberglass
- Total Thickness , ASTM D374 0.31mm
- Application Thermal management, Thermally conductive adhesive
-
BERGQUIST-SIL-PAD-TSP-1750-TDS.pdf
Size: 64.79 kB
Type: pdf
| Weight | 0.000753 kg |
|---|
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
Be the first to review “BERGQUIST SIL PAD TSP 1750”
Related products
Reviews
There are no reviews yet.