Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing through-put with a quick cure.
- Two component
- Both components silver-filled
- Electrically conductive
- Low temperature cure
Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing through-put with a quick cure.
Application Method | Dispense Gun |
Applications | Die Attach |
Cure Schedule, @ 65.0 °C | 6.0 hr. |
Cure Type | Heat Cure |
Number of Components | 2 Part |
Physical Form | Paste |
Shear Strength, Aluminum | 1200.0 psi |
Storage Temperature | 25.0 °C |
Technology | Epoxy |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 14000.0 mPa·s (cP) |
Volume Resistivity, Cured @ Recommended Cure Schedule | 0.015 Ohm cm |
Size: 66.59 kB
Type: pdf
Weight | N/A |
---|---|
Packaging | 1cc, 3cc, 5cc, 4cc/10cc, 10cc |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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