LOCTITE ABLESTIK CDF 500

LOCTITE ABLESTIK CDF 500 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm.

Product Benefits

• High MSL reliability
• Controlled fillet size
• No resin bleed-out
• Consistent bondline thickness
• Pre-cut wafer lamination equipment compatible
• Recommended for thin wafer handling applications
• Good wetting and low warpage for large die