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This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
Product Benefits
- Low stress
- Low thixotropy
- Low CTE
- High purity
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology Epoxy
- Appearance Black
- Components One-component
- Filler Weight, % 74 to 76
- Percent Solids by Weight 100
- Cure Heat Cure
- Application Encapsulant
- Operating Temperature -65 to 150 °C
- Typical Assembly Applications Glob top applications, Protecting wire bonded bare IC's and BGA
LOCTITE-ECCOBOND-50500-1-TDS.pdf
Size: 67.71 kB
Type: pdf
| Weight | N/A |
|---|---|
| package size | |
| Packaging | 30cc sy, 30cc syringe, 300cc cartridge |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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