From £164.91
LOCTITE ECCOBOND DAM 7010C is formulated to be used in combination with a “fill” encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant.
It is specially designed for glob top applications where protection of wire-bonded bare IC is required. This two-material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
| Colour | Black |
| Cure Type | Heat Cure |
| Number of Components | 1 Part |
Size: 68.76 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 30cc Syringe, 20oz Cartridge |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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