- Home
- Adhesives
- SMT Adhesives
- LOCTITE ECCOBOND E 1172 A
LOCTITE ECCOBOND E 1172 A
Product Information
LOCTITE ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. This product cures fast at low temperatures and exhibits low CTE with long pot life.
- Void free underfill
- Single component
- Long pot life
- Fast Cure
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
Video
Similar Products
You May Be Interested In
Recently Viewed
There are no recently viewed products.