From £264.56
LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.
LOCTITE ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device’s temperature cycling capability, distributing stress away from solder connects. This product cures fast at low temperatures and exhibits low CTE with long pot life.
| Cure Schedule, @ 135.0 °C | 6.0 min. |
| Glass Transition Temperature (Tg) | 135.0 °C |
| Viscosity, Brookfield, Spindle 3, speed 5 rpm | 17000.0 mPa·s (cP) |
Size: 70.55 kB
Type: pdf
| Weight | N/A |
|---|---|
| Packaging | 10cc (15g), 10 cc (15g), 30cc (40g), 55cc (80g), 6oz (200g) |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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