£184.53 ex.VAT (£221.44 inc.VAT)
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant.
Available to order. Your estimated delivery is: 26/01/2024
LOCTITE ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
| Coefficient of Thermal Expansion (CTE), Above Tg | 217.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 57.0 ppm/°C |
| Cure Schedule, @ 130.0 °C | 8.0 min. |
| Cure Type | Heat Cure |
| Glass Transition Temperature (Tg) | 2.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 6700.0 mPa·s (cP) |
Size: 67.67 kB
Type: pdf
| Weight | 0.052 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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